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日本国内VR実測事例の探索
Maker Faire 会場 3Dツアー
Galois P4で2026年9月5~6日に撮影したMaker Faire会場の3D空間をご覧いただけます。 会場全体を自由に移動しながら、高精細な空間モデルをご体験ください。
RepRap Festival 2026 - 3DMart
RepRap Festival 2026の会場をGalois P4で撮影しました。 会場内を自由に移動しながら、3DMartの展示内容と高精細な3D空間をご体験いただけます。
Bambu Lab PLA/PETG support material - transparent
Bambu Lab's ultimate support material is compatible with PLA and PETG cables. It can be easily removed without tools, preserving the original surface of the printed object.
Features
● Easy disassembly without tools ● Smooth and compatible interface ● Recommended for all PLA and PETG models
● Transparent appearance ● Equipped with high-temperature reusable spools ● Diameter: 1.75 mm +/- 0.05 mm
Features
● Easy disassembly without tools ● Smooth and compatible interface ● Recommended for all PLA and PETG models
● Transparent appearance ● Equipped with high-temperature reusable spools ● Diameter: 1.75 mm +/- 0.05 mm
Easy to disassemble without tools
Due to their polarity differences, the support for PLA/PETG is specially formulated to minimize fusion with both PLA and PETG. This unique characteristic ensures easy removal of the support interface, thereby reducing the risk of damage to printed objects.
Smooth support surface
Support PLA/PETG provides a consistently smooth surface quality in the contact area, ensuring optimal support for intricate details.
Our support material features zero top interface pitch and Z-distance, providing accuracy and reliability that allows you to easily print even the most complex designs.
Cross compatibility
Supports PLA/PETG and is designed for seamless use with both PLA and PETG without the need to change support materials. This saves you time and streamlines your workflow.
RFID Smart Printing
All printing parameters are embedded with RFID, which can be read, loaded, and printed through our AMS (Automatic Material System)! No more tedious setup steps are needed.
| diameter | 1.75 mm |
| Net weight of wire | 0.5 kg |
| spool material | PLA/PETG |
| Pre- print drying settings | 75 °C, 8 hours |
| Printing and storing humidity | < 20% RH (sealed, with desiccant) |
| Nozzle temperature | 190 - 220 ̊C |
| Printing plate type | Engineering panels, high-temperature printing platforms, or textured PEI boards |
| Printing platform temperature | 35 - 60 ̊C |
| Printing speed | < 100 mm /s |
physical properties
| density | 1.28 g/cm³ |
| Vicat softening temperature | N/A |
| Heat distortion temperature | N/A |
| melting temperature | 185 ̊C |
| Melt Flow Index | 14.3±1.2g/10min |
Mechanical properties
| Tensile strength | N/A |
| Elongation at break | N/A |
| Flexural modulus | N/A |
| Bending strength | N/A |
| Impact strength | N/A |